Most Recent Additions

 

Jazz Combo Recital
Corey Anco, Matt Noyes, Saul Ortega, Cory Sackett, and Steve Jacobson

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Evaluation of the catalytic decomposition of H2O2through use of organo-metallic complexes - A potential link to the luminol presumptive blood test
Thomas J. Soderquist, Olivia M. Chesniak, Matthew R. Witt, Alan Paramo, Victoria A. Keeling, and Jason J. Keleher

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Lead Memory in General Aviation Aircraft Engine Emissions
Randal DeMik, Jason Keleher, Natalie Kasak, Julius Keller, Alessandro Mazza, and Jordan Raess

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A biomimetic cellulose-based composite material that incorporates the antimicrobial metal-organic framework HKUST-1
Thomas A. Rickhoff, Erin Sullivan, L. K. Werth, Daniel S. Kissel, and Jason J. Keleher

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Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications
T. B. Zubi, R. A. Wiencek, A. L. Mlynarski, J. M. Truffa, K. M. Wortman-Otto, C. Saucedo, M. G. Salinas, C. F. Graverson, and J. J. Keleher

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Strategic Design of Antimicrobial Hydrogels Containing Biomimetic Additives for Enhanced Matrix Responsiveness and HDFa Wound Healing Rates
Abigail N. Linhart, Katherine M. Wortman-Otto, Ian Deninger, Abigail L. Dudek, Heather R. Lange, Dany M. Danhausen, Carolyn F. Graverson, Thomas J. Beckmann, Mallory A. Havens, and Jason J. Keleher

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Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance
Katherine M. Wortman-Otto, Carolyn F. Graverson, Abigail N. Linhart, Rose K. McDonough, Amy L. Mlynarski, and Jason J. Keleher

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Role of Molecular Structure on Modulating the Interfacial Dynamics for Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Applications
Katherine M. Wortman-Otto, Abigail N. Linhart, Abigail L. Dudek, Brian M. Sherry, and Jason J. Keleher

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Communication—An Analysis of Shear Forces in Post-CMP PVA Brush Scrubbing for Stationary and Rotating Wafers
Y. Sampurno, A. N. Linhart, K. M. Wortman-Otto, A. Philipossian, and J. J. Keleher

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Understanding the Reasons Behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes
Y. Sampurno, A. Philipossian, A. N. Linhart, K. M. Wortman-Otto, W-T Tseng, D. Tamboli, and J. J. Keleher

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Harnessing Fe(III)–Carboxylate Photochemistry for Radical-Initiated Polymerization in Hydrogels
M. H. Jayan S. Karunarathna, Abigail N. Linhart, Giuseppe E. Giammanco, Amie E. Norton, Jackson J. Chory, Jason J. Keleher, and Alexis D. Ostrowski

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Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes
Kiana A. Cahue, Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski, and Jason J. Keleher

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Slurry Activation for Enhanced Surface Redox Reactions in CMP
Ara Philipossian, Yasa Sampurno, Fritz Redeker, Kiana A. Cahue, and Jason J. Keleher

*Updated as of 05/28/25.