Most Popular Papers*

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Role of Molecular Structure on Modulating the Interfacial Dynamics for Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Applications
Katherine M. Wortman-Otto, Abigail N. Linhart, Abigail L. Dudek, Brian M. Sherry, and Jason J. Keleher

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Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications
Michelle Yap, Catherine Yap, Yasa Sampurno, Glenn Whitener, Jason Keleher, Len Borucki, and Ara Philipossian

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