Most Popular Papers*

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Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications
Michelle Yap, Catherine Yap, Yasa Sampurno, Glenn Whitener, Jason Keleher, Len Borucki, and Ara Philipossian

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Lead Memory in General Aviation Aircraft Engine Emissions
Randal DeMik, Jason Keleher, Natalie Kasak, Julius Keller, Alessandro Mazza, and Jordan Raess

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Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications
T. B. Zubi, R. A. Wiencek, A. L. Mlynarski, J. M. Truffa, K. M. Wortman-Otto, C. Saucedo, M. G. Salinas, C. F. Graverson, and J. J. Keleher

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