Communication—An Analysis of Shear Forces in Post-CMP PVA Brush Scrubbing for Stationary and Rotating Wafers
Category of Work
Article
Publication Title
ECS Journal of Solid State Science and Technology
Abstract
After defining certain sign conventions for sliding velocity and shear force for a PVA brush scrubbing process, a simple kinematics model is used to calculate net sliding velocities in the brush-wafer contact region. Next, a series of experiments are performed where brush velocity is gradually increased while the wafer is kept stationery, and repeated again with the wafer rotating at a certain velocity. For a stationary wafer, with increasing brush velocity, partial lubrication takes effect which results in less brush asperity contact (i.e. a reduction in SF). For a rotating wafer, SF decreases significantly. We attribute this to the net negative sliding velocity across the wafer that partially offsets the positive SF values. However, SF rises with brush velocity which is likely due to fluid distribution effects and increased brush asperity-wafer contact.
DOI
doi.org/10.1149/2162-8777/abe4a7
Publication Date
3-3-2021
Recommended Citation
Sampurno, Y.; Linhart, A. N.; Wortman-Otto, K. M.; Philipossian, A.; and Keleher, J. J., "Communication—An Analysis of Shear Forces in Post-CMP PVA Brush Scrubbing for Stationary and Rotating Wafers" (2021). Chemistry Department Faculty Articles. 50.
https://digitalcommons.lewisu.edu/chemistry_facpubs/50
