Category of Work

Article

Publication Title

ECS Journal of Solid State Science and Technology

Abstract

Due to the emergence of sub-10 nm technologies, next generation slurries have continued to increase in complexity to meet stringent device performance demands. Prior to the chemical mechanical planarization (CMP) process, point-of-use filtration (POU) is implemented in order to limit particle aggregates and ultimately decrease surface defects. This study probes the non-covalent interactions at the interface of a fundamental Cu slurry and a polyamide and polypropylene-based membranes. Results indicate that independent of the membrane used, material removal rate (MRR) showed a subtle decrease as a result of filtration (time and P), demonstrating that the synergistic balance between the nanoparticle and slurry additives is disrupted during the filtration process. Corrosion current measurements (Icorr) decreased by at least 85% post-filtration, indicating a rapid adsorption of glycine to the filter membrane. Regardless of the filter membrane, glycine adsorption was further validated using a modified electrochemical quartz crystal nanobalance (EQCN) technique. Since Cu-glycine complexes are integral in controlling MRR, a widely reported method of tracking ∗OH production was employed. Results show a decrease in the concentration of ∗OH, which in turn can be correlated to a decrease in the Cu-glycine complexes, altering the overall Cu MRR.

First Page

P3022

Last Page

P3027

DOI

doi.org/10.1149/2.0041905jss

Publication Date

1-12-2019

Creative Commons License

Creative Commons Attribution 4.0 International License
This work is licensed under a Creative Commons Attribution 4.0 International License.

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Chemistry Commons

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